Hardware
System Semiconductor
System Semiconductor (System-in-Package)
- Highly integrated One-chip solution (Optimized for edge AI)
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Semiconductor Package Part
- Micro Processor + 6 Axis Sensor + BLE Module

Application Field
- Automotive Application - (Tyre Inner-liner mounted)
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Other Smart device makers (AI Embedded device)
- Smart Wearable / Smart Farm / Smart Home / Smart Toys

Neurosense System Semiconductor Competitive Advantages
Edge computing AI(On-device AI) Technology Competitiveness
Dedicated NeuroSense’s Edge AI Tool Chain and optimized hardware to provide new value propositions


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- 데이터
- 데이터 수집, 가공 및 관리 (데이터 수집 어플리케이션)
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- 무선통신 데이터 수집
- 데이터 레이블링 및 메타데이터 관리
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- Machine Learning
- Intellingece Pack (파이썬기반의 머신러닝 알고리즘 프레임 워크)
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- 데이터 프로세싱
- 특징 추출 및 선정
- 학습 시뮬레이션
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- Bin. SW
- 하드웨어 포팅 (펌웨어 개발)
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- 알고리즘 임베디드 변환
- 펌웨어 개발
- 하드웨어 포팅
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1. Development Lead-time
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Normal
- Third-party AI tool acquisition and linkage development period ~1.5 year
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AI
- Algorithm development and hardware implementation takes 1~2 months
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2. Cost
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Normal
- Billions of developments costs (FW + AI)
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AI
- At the price of $5~ Algorithm and firmware development support
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3. Manpower
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Normal
- PCB design, F/W design, algorithm design, engineers, etc. need a number of skilled development engineers
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AI
- Minimum domain engineering resource required for development (1~2 engineers)
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Neurosense System Semiconductor Competitive Advantage
You can see it by scrolling horizontally.

- Low Power :
- Low Power MCU& BLE Module Use(Nordic)
- H/W Architecture Optimized for Edge AI
- Reduces costs by operating on low-end MCUs
- Neurosense specific Edge AI S/W Tool Chain
- Development lead time reduction (80% or more)
- Super-integration to be expandable to various applications
- Reduced size by more than 50% compared to PCB
- Price competitiveness
- Reduce material cost by more than 30% compared to PCB
- Product verification for mass production completed
- Securing reliability in Manufacturing major Parts and circuits
