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System Semiconductor

System Semiconductor(ELA106) Development Support Hardware

Smart chip ELA106 optimized for embedded AI

IoT dedicated chip through SiP of ‘6-axis IMU sensor + low power processor + low power BLE communication’
Smart chip that lowers the barrier to entry for small and medium-sized businesses to AI IoT development WHY?

WHY?

  • ㆍDevice package required for IoT development improves developer convenience
  • ㆍSmall size realizes IoT product miniaturization
  • ㆍRealization of material cost reduction due to product miniaturization
  • ㆍSupport for rapid commercialization by providing development board, driving source code, and demo smartphone application

ELA106

Smart SiP Chip

  • Nordic nRF52832
  • Bosch BMI 160 IMU

Wireless Module

ELA106 RF module

  • Chip antenna added

Development Board NEMo

ELA106 + Sensor kit

  • Environmental sensors
  • Microphone
  • USB power or Coin cell

Evaluation Application

Mobile Application

  • Android app.

ELA106

Smart SiP Chip

  • Nordic nRF52832
  • Bosch BMI 160 IMU

Wireless Module

ELA106 RF module

  • Chip antenna added

Development Board NEMo

ELA106 + Sensor kit

  • Environmental sensors
  • Microphone
  • USB power or Coin cell

Evaluation Application

Mobile Application

  • Android app.

ELA106 – Quick Integration Solution for the Motion Recognition

[ELA106 module block diagram]

  • Bosch BMI160 6-axis accelerometer and gyroscope
  • Nordic nRF52832 Bluetooth Smart®
  • Bluetooth® v5
  • ANT, NFC Tag
  • Packaging: LGA44
  • Bluetooth/ANT Antenna Configuration:
  • On-board PCB antenna
  • Supports external antenna from pin pad
  • Host interface: UART, SPI
  • Other interfaces: 18 GPIO, 8 ADC, UART, SPI (master and slave), I2C, PWM and Debug SWD
  • Operating temperature range: -40 ºC to 85 ºC
  • Pattern matching engine software supported by development request

[ELA106 module placement overview]

WHY ELA106?

  • Implemented a large number of proven, motion data sets
  • Model IP cost included
  • Low cost motion sensor + BLE SiP
  • Realize product miniaturization with super small size