System Semiconductor
System Semiconductor(ELA106) Development Support Hardware
Smart chip ELA106 optimized for embedded AI
IoT dedicated chip through SiP of ‘6-axis IMU sensor + low power processor + low power BLE communication’
Smart chip that lowers the barrier to entry for small and medium-sized businesses to AI IoT development WHY?
WHY?
- ㆍDevice package required for IoT development improves developer convenience
- ㆍSmall size realizes IoT product miniaturization
- ㆍRealization of material cost reduction due to product miniaturization
- ㆍSupport for rapid commercialization by providing development board, driving source code, and demo smartphone application
ELA106
Smart SiP Chip
- Nordic nRF52832
- Bosch BMI 160 IMU
Wireless Module
ELA106 RF module
- Chip antenna added
Development Board NEMo
ELA106 + Sensor kit
- Environmental sensors
- Microphone
- USB power or Coin cell
Evaluation Application
Mobile Application
- Android app.
ELA106
Smart SiP Chip
- Nordic nRF52832
- Bosch BMI 160 IMU
Wireless Module
ELA106 RF module
- Chip antenna added
Development Board NEMo
ELA106 + Sensor kit
- Environmental sensors
- Microphone
- USB power or Coin cell
Evaluation Application
Mobile Application
- Android app.
ELA106 – Quick Integration Solution for the Motion Recognition
[ELA106 module block diagram]
- Bosch BMI160 6-axis accelerometer and gyroscope
- Nordic nRF52832 Bluetooth Smart®
- Bluetooth® v5
- ANT, NFC Tag
- Packaging: LGA44
- Bluetooth/ANT Antenna Configuration:
- On-board PCB antenna
- Supports external antenna from pin pad
- Host interface: UART, SPI
- Other interfaces: 18 GPIO, 8 ADC, UART, SPI (master and slave), I2C, PWM and Debug SWD
- Operating temperature range: -40 ºC to 85 ºC
- Pattern matching engine software supported by development request
[ELA106 module placement overview]
WHY ELA106?
- Implemented a large number of proven, motion data sets
- Model IP cost included
- Low cost motion sensor + BLE SiP
- Realize product miniaturization with super small size